Heat dissipating system

ABSTRACT

A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a divisional application of U.S. Ser. No.17/315,243 filed on May 7, 2021. The entire disclosures of the aboveapplication are all incorporated herein by reference.

BACKGROUND Technical Field

The disclosure relates to a heat dissipating system, particularly to aliquid cooling loop heat dissipating system thereof.

Related Art

A related-art water cooling heat dissipating device or system forelectronic heat-generating apparatuses separately delivers coolant to acooling head of each server through a water tank. Each cooling head isconnected through a cycle loop communicating with the water tank, sothat the coolant is delivered to the cooling head of corresponding heatsource. As a result, after the cooling head absorbs the heat from theheat source, the coolant is delivered back to the water tank to becooled.

A related-art cycle loop in a server module usually uses a single pumpto deliver coolant in a specific direction. However, with the increaseof the components in a server, the structure of multiple cooling headsconnected in series is adopted. A single pump configured in series mayreduce the propulsion of coolant flow. Adding pumps alone is also hardto effectively perform full power of each pump and makes the flow ofcoolant be ununiformly.

SUMMARY

An object of the disclosure is to provide a liquid cooling loop heatdissipating device and a heat dissipating system thereof, which utilizesthe arrangement of multiple pumps to be advantageously installed in alimited space and to effectively supply the delivery power of coolant toaccurately control the flow.

To accomplish the above object, the disclosure provides a liquid coolingloop heat dissipating device, which includes a power distributionassembly and two convergence delivery assemblies. The power distributionassembly includes a first cooling reservoir, a second cooling reservoir,multiple cooling pumps disposed on the first cooling reservoir, and aserial pipeline and a cooling head separately corresponding to each ofthe cooling pumps. The two convergence delivery assemblies separatelycommunicate with first cooling reservoir and the second coolingreservoir and are separately arranged on two sides of the powerdistribution assembly. The serial pipeline is connected with the coolinghead in series to communicate between the first cooling reservoir andthe second cooling reservoir.

To accomplish the object, the disclosure provides a liquid cooling loopheat dissipating system, which includes a console box, multiple casingsand two divergence assemblies. The casings are vertically stacked witheach other to be together disposed on the console box. Each casing isprovided with a liquid cooling loop heat dissipating device. The twodivergence assemblies are disposed outside a side of the casings beingstacked and communicate with the liquid cooling loop heat dissipatingdevice in each casing. The liquid cooling loop heat dissipating deviceincludes a power distribution assembly and two convergence deliveryassemblies. The power distribution assembly includes a first coolingreservoir, a second cooling reservoir, multiple cooling pumps disposedon the first cooling reservoir, and a serial pipeline and a cooling headseparately corresponding to each of the cooling pumps. The serialpipeline is connected with the cooling head in series to communicatebetween the first cooling reservoir and the second cooling reservoir.The two convergence delivery assemblies separately communicate withfirst cooling reservoir and the second cooling reservoir and areseparately arranged on two sides of the power distribution assembly.

In view of this, the inventors have devoted themselves to theabovementioned related art, researched intensively and cooperated withthe application of science to try to solve the abovementioned problems.Finally, the invention which is reasonable and effective to overcome theabove drawbacks is provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective schematic view of the liquid cooling loop heatdissipating device heat dissipating system of the disclosure;

FIG. 2 is a partially enlarged view of the liquid cooling loop heatdissipating device heat dissipating system of the disclosure;

FIG. 3 is a schematic plan view of the liquid cooling loop heatdissipating device cooling device of the disclosure disposed in amodule;

FIG. 4 is perspective schematic view of the liquid cooling loop heatdissipating device cooling device of the disclosure;

FIG. 5 is a partially cross-sectional schematic view of the liquidcooling loop heat dissipating device cooling device of the disclosure;and

FIG. 6 is a schematic view of the distribution assembly of thedisclosure.

DETAILED DESCRIPTION

The technical contents of this disclosure will become apparent with thedetailed description of embodiments accompanied with the illustration ofrelated drawings as follows. It is intended that the embodiments anddrawings disclosed herein are to be considered illustrative rather thanrestrictive.

Please refer to FIGS. 1-2 , which are a perspective schematic view and apartially enlarged view of the liquid cooling loop heat dissipatingdevice heat dissipating system of the disclosure, respectively.

The disclosure provides a liquid cooling loop heat dissipating deviceand a heat dissipating system thereof. The liquid cooling loop heatdissipating system includes a console box 1, multiple casings 2 stackedon the console box 1 and at least two divergence assemblies 3 separatelycommunicating between the console box 1 and each casing 2. The liquidcooling loop heat dissipating device 4 is disposed in each casing 2 andcommunicates with the two divergence assemblies 2.

The console box 1 may be a water tank, or a case with the assemblies,such as a main pump, a water tank and a heat exchanger, etc., disposedinside. Furthermore, the console box 1 may be provided with a coolingdistribution unit (CDU) for controlling the operation of the pumps anddetecting the efficiency of heat exchange.

Please further refer to FIG. 3 . The inside of the casing 2 may beprovided with an electronic operating unit such as a sever board 20. Thecasings 2 are vertically stacked with each other to be together disposedon the console box 1. The liquid cooling loop heat dissipating device 4is disposed in each casing 2. The liquid cooling loop heat dissipatingdevice 4 communicates with the two divergence assemblies 3. The coolantin the console box 1 is delivered to the liquid cooling loop heatdissipating device 4 by the divergence assemblies 3 to perform heatdissipation to the electronic operating unit such as the server board.

Please refer to FIGS. 1-2 . The two divergence assemblies 3 are disposedoutside a side of the casings 2 being stacked. The two divergenceassemblies 3 may be located on the same side or different sides. Eachdivergence assembly 3 has a diverging reservoir 30, a connecting tube 31communicating from the console box 1 to the diverging reservoir 30, andmultiple diverging pumps 32 disposed on the diverging reservoir 30. Thediverging reservoir 30 is of a rod shape along the stacked direction ofthe casings 2 for the diverging pumps 32 to be sequentially mountedthereon for power communication. Each diverging pump 32 has a curvedtube 320 communicating to the inside of corresponding casings 2respectively and connecting with the liquid cooling loop heatdissipating device 4 as shown in FIG. 3 respectively.

Please refer to FIGS. 3-5 . The liquid cooling loop heat dissipatingdevice 4 includes a power distribution assembly 40 and two convergencedelivery assemblies 41. The power distribution assembly 40 includes afirst cooling reservoir 400, a second cooling reservoir 401, multiplecooling pumps 402 disposed on the first cooling reservoir 400, and aserial pipeline 403 and a cooling head 404 separately corresponding toeach of the cooling pumps 402. The two convergence delivery assemblies41 separately communicate with first cooling reservoir 400 and thesecond cooling reservoir 401 and are separately arranged on two sides ofthe power distribution assembly 40 so as to be extended to the twodivergence assemblies 3 to communicate with the curve tubes 320 of thediverging pumps 32 for providing the coolant to perform circular heatdissipation. In detail, the serial pipeline 403 may be divided into afirst pipeline 403 a, a second pipeline 403 b and a third pipeline 403c. The cooling head 404 may be multiple in number depending on therequired heat source, for example, a first cooling head 404 a and asecond cooling head 404 b communicate between the first coolingreservoir 400 and the second cooling reservoir 401 through the first,second and third pipelines 403 a, 403 b and 403 c connected in series tomake each cooling pump 402 provide required coolant driving power toeach serial pipeline 403. Also, the coolant may be converged anddiverged. Further, the first cooling reservoir 400 and the secondcooling reservoir 401, which are disposed on two sides of the powerdistribution unit 40, may serve the flowing-in and flowing-out of thecoolant and communicate with the two divergence assemblies 3 toconfigure a circular loop without affecting the arrangement of theserial pipeline 403 and the cooling head 404 corresponding to each heatsource. Also, each cooling pump 402 in the circular loop may control thedriving power to the coolant in each serial pipeline 403 to beconsistent to accomplish the object of uniform cooling and heatdissipation.

As shown in FIG. 5 , the second cooling reservoir 401 and the firstcooling reservoir 400 may be horizontally arranged in a side by sidemanner and the second cooling reservoir 401 is located at a lowerposition on an inner side of the first cooling reservoir 400 for thecooling pumps 402 to be disposed above the first cooling reservoir 400.Also, the first pipeline 403 a may be higher than the second and thirdpipelines 403 b, 403 c and the cooling heads 404 to be advantageous onrecirculation. The second, third pipelines 403 b, 403 c may have acurved section respectively for connecting to the second coolingreservoir 401 at the lower position.

In addition, as shown in FIG. 6 , the diverging pumps 32 of thedivergence assemblies 3 are arranged on a side of the divergingreservoir 30. The side indicates a lateral position of the divergingreservoir 30 facing the casings 2, for example, the sides of thediverging reservoirs 30 of the two divergence assemblies 3 facing eachother. Of course, the diverging pumps 32 may be arranged on the sidesopposite to each other (i.e., the outer side of the diverging reservoir30), or arranged on an interlaced manner of the combination ofaforementioned arrangement. As a result, a distance D between thediverging reservoir 30 of each divergence assembly 3 and the casing 2 iswider to facilitate the arrangement of the curved tube 320. Thus, thecurved tube 320 has sufficient length for the diverging pump 32 to pumpthe coolant into the liquid cooling loop heat dissipating device 4 or topump the coolant from the liquid cooling loop heat dissipating device 4to the diverging reservoir 30.

Therefore, by the abovementioned structure, the liquid cooling loop heatdissipating device and the heat dissipating system of the disclosure areobtained.

While this disclosure has been described by means of specificembodiments, numerous modifications and variations could be made theretoby those skilled in the art without departing from the scope and spiritof this disclosure set forth in the claims.

What is claimed is:
 1. A liquid cooling loop heat dissipating systemcomprising: a console box; multiple casings, vertically stacked witheach other to be together disposed on the console box, and each casingcomprising a liquid cooling loop heat dissipating device disposedtherein; and two divergence assemblies, disposed outside a side of thecasings being stacked, and communicating with the liquid cooling loopheat dissipating device in each casing; wherein the liquid cooling loopheat dissipating device comprises: a power distribution assembly,comprising a first cooling reservoir, a second cooling reservoir,multiple cooling pumps disposed on the first cooling reservoir, and aserial pipeline and a cooling head corresponding to each of the coolingpumps respectively, and the serial pipeline is connected with thecooling head in series to communicate between the first coolingreservoir and the second cooling reservoir; and two convergence deliveryassemblies, communicating with first cooling reservoir and the secondcooling reservoir respectively, and arranged on two sides of the powerdistribution assembly respectively.
 2. The liquid cooling loop heatdissipating system of claim 1, wherein each divergence assemblycomprises a diverging reservoir, a connecting tube communicating fromthe console box to the diverging reservoir, and multiple diverging pumpsdisposed on the diverging reservoir, and each diverging pump comprises acurved tube communicating and connected with the liquid cooling loopheat dissipating device in each of the casings correspondingly.
 3. Theliquid cooling loop heat dissipating system of claim 1, wherein thediverging reservoir is of a rod shape along a stacked direction of thecasings.
 4. The liquid cooling loop heat dissipating system of claim 1,wherein the serial pipeline of the liquid cooling loop heat dissipatingdevice comprises a first pipeline, a second pipeline, and a thirdpipeline, the cooling head is multiple in number, and the multiplecooling heads are connected in series by the first pipeline, the secondpipeline, and the third pipeline.
 5. The liquid cooling loop heatdissipating system of claim 1, wherein the second cooling reservoir andthe first cooling reservoir of the liquid cooling loop heat dissipatingdevice are horizontally arranged in a side by side manner, and thesecond cooling reservoir is located on an inner side of the firstcooling reservoir.
 6. The liquid cooling loop heat dissipating system ofclaim 5, wherein a position of the second cooling reservoir is lowerthan a position of the first cooling reservoir.
 7. The liquid coolingloop heat dissipating system of claim 5, wherein the cooling pumps aredisposed above the first cooling reservoir.